CMP Material Market
Trending Highlights of the Market:
Chemical-mechanical polishing (CMP) is often associated with chemical-mechanical planarization which is a polishing process assisted by chemical reactions to remove surface materials. CMP is a standard manufacturing process practiced at the semiconductor industry to fabricate integrated circuits and memory disks. When the purpose is to remove surface materials, it is referred to as chemical-mechanical polishing. Chemical mechanical planarization (CMP) has emerged as a critical step in integrated circuit fabrication for achieving global surface planarization of various thin films in the front- and back-end processing. This has led to the development of novel and advanced post-CMP cleaning techniques that can effectively remove different types of contaminants (e.g., particulate, organic, metallic, etc.) from surfaces. There is an increasing effort toward improving the fundamental understanding of the interfacial phenomena and the underlying physical and mechanical mechanisms that drive the post-CMP cleaning process.
The market has been segment into North America, South America, Europe, Asia-Pacific, and Middle East and Africa. Governments around the world are increasingly supporting digitalization, eventually promoting the usage of various electronic devices among consumers. This is anticipated to support the semiconductor industry along with its parent market i.e., the consumer electronics market in Europe.
Some of the key market players of the CMP Material Market are Saint-Gobain, Cabot Microelectronics, Ace Nanochem, Dow Electronic Materials, WEC Group, Fujimi Incorporated, Ferro Corporation, Air Products/Versum Materials, AGC Inc., and Hitachi Chemical.
The CMP Material Market is discussed on the basis of Product Type into CMP Slurries, CMP Pads, within which CMP Slurries has been the most contributing segment of the market since the recent years. Given the stringent requirements in the material consumable space, it is increasingly important to establish a good understanding of the impact of pad material properties on CMP process performance. On the basis of Application into Optical Substrates, Disk -drive Components, Silicon Wafers and Others, within which the Optical Substrates have the largest share to the market.